Reltech Limited

Since 1976 Reltech Limited has served the global semiconductor industry, providing both innovative Burn-In/Life-Test Systems and Reliability and Qualification testing services to industry leading Fabless and OEM semiconductor companies. Our vast experience in system design and manufacture and reliability testing, enables us to offer our customers full turn-key solutions covering all aspects of Semiconductor reliability including qualification planning, test hardware design and manufacture, test software development and the complete qualification testing of our customer products. All testing is performed to industry and customer specific standards and is supported by highly trained and competent personnel, assuring users of the up-most integrity and confidentiality at all times.

 

Reltech Limited Independent Test Laboratory
Reltech Limited founded in 1976 is an Independent Test Laboratory, Burn-In and HTOL system manufacturer serving the Semiconductor and Microelectronics industries

 

Reltech Limited HTOL System

Reltech​ 7000 Series HTOL System

7000 Series

Reltech HTOL systems – changing concepts

With ever decreasing geometries, the way we perform HTOL requires careful consideration.

In lower geometry device leakage currents are not only higher but vary greatly.

Temperature control at DUT level – required to achieve correct junction temperature at every DUT.

For higher geometries, HTOL can be performed in a more traditional way but with devices consuming more power, the ambient temperatures required varies greatly.

Multiple temperature zones are required – multi zones system or multiple smaller HTOL systems.

Reltech 7121 HTOL system

21 HTOL Trays per chamber

2.5m/s airflow high power

< 5W HTOL application

Up to 5 HTOL Lots per chamber

192 I/O’s per Tray

5 voltage rails per tray

Easy access to Driver Card at front of chamber

Lattice front – flexible load/unload timing

Driver Cards – Digital/Analogue/Mixed signal

Standard or application specific

DUT monitoring and logging via PC and MIDAS software

 

HTOL Mother/Daughter board

HTOL Board with Dynamic Driver Card

 

8000 Series

Today’s low geometry semiconductor devices require a different approach to performing High Temperature Operating Life (HTOL) and “Burn-In”. Core Leakage currents vary greatly between device die, even when from the same wafer, and are significantly higher than those of larger geometry devices. These leakage currents result in self-heating within the device and increased junction temperatures (Tj). In order to control the junction temperature to within acceptable limits and to increase product yield, it is necessary to control the temperature of each device independently. This is not possible in conventional chamber based HTOL systems. The Reltech independent Test Laboratory is pleased to announce the latest addition to its portfolio of semiconductor qualification test systems. The Reltech 8000 series HTOL system incorporating iSocket™ technology, provides the highest level of thermal control possible for High Temperature Operating Life Testing and Burn-In of the very latest low geometry, high power semiconductor devices.

 

8014 HTOL System Features:

iSocketTM Technology

Open Rack-Room Temperature (RTBI) non chamber design

 High Power DUT Capability – 0-65W

 Individual DUT Temperature Measurement & Control

 DUT Monitoring with Auto shut down

28 BIB capacity – 14 trays 2 BIB’s per tray

 Multi DUT type HTOL Testing

 Remote System & HTOL Monitoring – Customer access via VPN

Driver Performance:

Vector Channels: 64

Max Vector Frequency (recommended):20MHz

DUT Monitor Channels:60

 

Reltech 9000 Ultra High Power HTOL Systems

9000 Data Sheet

As the world becomes further connected, the infrastructure that supports this world is becoming increasingly complex and demands semiconductor devices with very powerful processing capability.

 

Artificial Intelligence (AI) is at the forefront of many organizations’ development and the success of AI depends heavily on storage, communication speed, networking, and ultimately very powerful processing capabilities. The critical nature of these data crunching, power hungry processors relies that not a single error or misstep occurs, which is driving equipment that handle the devices as if they are in the final application.

 

The accelerated life testing of these devices is driving the need for more advanced test systems and equipment capable of handling very high power operation surpassing the capabilities of conventional High Temperature Operating Life (HTOL) or Burn-in systems using traditional air convection methods for temperature control.

 

Reltech Limited is pleased to announce the latest addition to its portfolio of semiconductor qualification test systems. The Reltech 9000 series HTOL system, developed in conjunction with Sensata Technologies and incorporates the very latest in Sensata’s Qinex iSocket™ technology with liquid thermal control, controlling devices with up to 800W dissipation

 

Reltech Limited HTOL Driver Cards

A wide range of Driver card are available suitable for HTOL, THB, LTOL, and HAST test applications.  All device technologies are catered for whether it be Digital , Analogue, Mixed Signal, low voltage <0.5v, high voltage >>3KV.

The following driver card overview is an example from our standard range of driver cards and demonstrates some of the typical specifications available. Bespoke designed driver card to suit customer’s individual  requirements are also available.

Typical Advanced Mixed Signal Driver Card

7000 and 8000 HTOL System compatible

64 Digital Vector Channels

60 DUT Output Monitor Channels

1 Analogue Output Channel

64Mb Vector Memory Depth

Vih Level: 1.0 – 5.0v

Vector Looping – 2 Loops – infinite or repeat count

6 Power Supply Outputs

 

Qualification Hardware & Sockets

Reltech Limited holds over 35 years’ experience in the design and manufacture of all types of qualification test hardware. Our advanced technology products include:

  • HTOL Boards (Mother and Daughter cards)
  • Burn-In Boards
  • HAST Boards
  • THB (humidity) Boards
  • Burn-In Modules and frames
  • Dynamic Driver cards (Digital, Analogue and Mixed signal)
  • Back Planes
  • Voltage regulator cards
  • Custom electro-mechanical assemblies
  • DUT Cassettes and test Fixtures

The integrity and performance of test hardware is one of the most important aspects of the semiconductor device test and qualification process. The interface hardware needs to be of the highest performance capability, providing consistent and repeatable test results, with the ability to withstand stringent environment test conditions including operating temperatures to +300°C, relative humidity to 95% , atmospheric pressure to 33psia and allow clock and signal speeds up to 100MHz with signal integrity and minimum distortion.

Reltech employ the latest PCB design CAD software for the design of its hardware and are engaged with technology leading PCB  manufacturing specialists adopting the most advanced technologies available.

  • Multilayer designs – + 20 layer
  • Copper filled flat pad technology
  • Buried laser drilled micro- via holes
  • 2 thou (0.05mm) track and gap geometry
  • > 0.3mm pitch WLCSP, micro BGA, QFN socket compatible

 

Burn-In Test Sockets

The selection of the test socket is critical to the performance of a device during qualification testing where electrical  bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.

Reltech works closely with all of the industry leading socket manufacturers and has a vast amount of experience in test socket technology, enabling you to receive the best advice and ensure correct selection of the socket most suited to your test needs; assuring you of a high level of performance to withstand even the most hostile test environments.

A wide range of test sockets are available offering a multitude of different socket styles to suit leading edge package technologies, including fine pitch flip chip Ball Grid Array (FCBGA), CSP (Chip Scale Package), QFN, TSSOP, TQFP, SOP and all other semiconductor package styles.

Reltech also provides burn-test socket “iSocket” solutions with active temperature DUT control.

 

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